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Bert Thin Films, Inc attended the IEEE PVSC and presented a poster titled “High Temperature Copper Metallization: Demand, Hurdles and Reliability” in Seattle, WA.  In this study, a low-cost alternative to silver metallization pastes has been shown on PERC cells. The screen printable copper paste can be fired in air, at temperatures >500°C, and the impact of processing conditions and equipment on the performance and reliability of 274 cm2 cells have been evaluated. 

Conference Information for the 52nd IEEE Photovoltaic Specialists Conferencehttps://ieee-pvsc.org/PVSC52/ 

Bert Thin Films continues to grow under the leadership of Thad Druffel and Ruvini Dharmadasa, welcoming Dr. Matt Healy to the team as the Chief Strategy Officer focusing on moving the proven results into commercialization.  Matt has been working in advanced materials for the past 25 years, including roles at ATMI, Ferro, Kurt J. Lesker Company, and Pixelligent.  He often focuses on the transition between technology development and commercialization.     Matt has a PhD in Chemistry and an MBA.  He is an avid rower and chess player.   


Read Matt's LinkedIn Profile: https://www.linkedin.com/in/matt-healy-0932071/ 

Bert Thin Films presented results of their copper-based pastes in a poster titled “Durability of Copper Printed Contacts for Silicon Solar Cells” in Lakewood, Colorado.  This poster discussed the durability of silicon solar cells with a screen-printed copper paste that has fired through the SiN layer using a belt furnace. The paste chemistry forms a Cu-diffusion barrier during firing. Details of the paste rheology and firing process were described. Results of the solar cell response after prolonged exposure to dry heat and damp heat tests were also presented. https://pvrw.nrel.gov 

Read more about the workshop at ​PVRW: Photovoltaic Reliability Workshop: https://pvrw.nrel.gov

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