Bert Thin Films, Inc attended the IEEE PVSC and presented a poster titled “High Temperature Copper Metallization: Demand, Hurdles and Reliability” in Seattle, WA. In this study, a low-cost alternative to silver metallization pastes has been shown on PERC cells. The screen printable copper paste can be fired in air, at temperatures >500°C, and the impact of processing conditions and equipment on the performance and reliability of 274 cm2 cells have been evaluated.
Conference Information for the 52nd IEEE Photovoltaic Specialists Conference: https://ieee-pvsc.org/PVSC52/