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IEEE Photovoltaic Specialists Conference

  • Karen Druffel
  • Jun 10, 2024
  • 1 min read

Updated: Mar 20

Bert Thin Films, Inc attended the IEEE PVSC and presented a poster titled “High Temperature Copper Metallization: Demand, Hurdles and Reliability” in Seattle, WA.  In this study, a low-cost alternative to silver metallization pastes has been shown on PERC cells. The screen printable copper paste can be fired in air, at temperatures >500°C, and the impact of processing conditions and equipment on the performance and reliability of 274 cm2 cells have been evaluated. 

Conference Information for the 52nd IEEE Photovoltaic Specialists Conferencehttps://ieee-pvsc.org/PVSC52/ 

 
 

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