Bert Thin Films was awarded $500k to continue the development of the copper based pastes as being developed as part of the National Science Foundation SBIR program. The work will extend the technology development which includes making changes at the cell level to keep up with the rapidly changing solar cell architectures being introduced by the industry.
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Plug and Play Copper Pastes
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See AllBert Thin Films, Inc attended the IEEE PVSC and presented a poster titled “High Temperature Copper Metallization: Demand, Hurdles and...
Bert Thin Films continues to grow under the leadership of Thad Druffel and Ruvini Dharmadasa, welcoming Dr. Matt Healy to the team as the...
Bert Thin Films presented results of their copper-based pastes in a poster titled “Durability of Copper Printed Contacts for Silicon...
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