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October 8 – 9, 2024, San Francisco, CA, USA


Bert Thin Films gave a presentation on the progress at the company during a start-up company pitch session.  Recent results on Cu paste performance were shown, although with the Bert Thin Films strategy to bring these innovative products to market. 


Presentation: From Silver to Copper: Paving the Way for Solar


Bert Thin Films, Inc attended the IEEE PVSC and presented a poster titled “High Temperature Copper Metallization: Demand, Hurdles and Reliability” in Seattle, WA.  In this study, a low-cost alternative to silver metallization pastes has been shown on PERC cells. The screen printable copper paste can be fired in air, at temperatures >500°C, and the impact of processing conditions and equipment on the performance and reliability of 274 cm2 cells have been evaluated. 

Conference Information for the 52nd IEEE Photovoltaic Specialists Conferencehttps://ieee-pvsc.org/PVSC52/ 

©2025 by Bert Thin Films, Inc

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