Plug and Play Copper Pastes
Durability of CuBert™
Proven to last
Confirmed cell stability with 1,000 hours of high temperature accelerated testing.
Demonstrated resilience over time
Near to no degradation with 1,000 hours of exposure to high humidity as per IEC 61215.
Near to no adhesion loss over 200 cycles of thermal cycling tests as per IEC 61215.
No copper diffusion
Silicon cells fired at 600 °C yield high Voc, indicating undamaged contacts during processing.
Accelerated aging maintains high Voc and pseudo fill factor, preserving the inherent barrier layer established during firing.
The team at Bert Thin Films has developed CuBert™ which is scalable, achieves high efficiencies and has proven durability. To learn more, contact info@BertThinFilms.com.
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Durability of CuBert™
The team at Bert Thin Films, Inc has demonstrated the durability of cells utilizing CuBert™ copper paste. Testing indicates that CuBert™ maintains performance throughout 1,000 hours of accelerated testing.
Cells fired using CuBert™ pastes have undergone accelerated testing at both cell level and module levels. At cell level, testing involves exposing full sized M10 cells to an elevated temperature and monitoring the Voc and pFF. M10 TOPCon cells printed with CuBert™ were kept at 200 °C for 1,000 hours and monitored. The data, shown in figure 1, shows no significant change in the Voc or pseudo fill factor (pFF), indicating copper is not diffusing into the cells.
Figure 1. pFF of M10 TOPCon cells printed with CuBert™
Durability of the cells in damp heat conditions was demonstrated by exposing test cells to 85 °C/ 85% RH for 1,000 hours based on the IEC 61215 standard. Figure 2 shows the cells saw little degradation compared to the silver reference.
Figure 2. Performance of modules in damp heat.
The interconnection of a 16 cell module by soldering was achieved as shown in the electroluminescence (figure 3). The 16-cell modules were used to evaluate the reliability of the solder joints between the CuBert metallization™ and interconnecting wires. This was done using a thermal cycling test, cycling the modules between -40 °C and 85 °C based on the IEC 61215 standard. Results revealed less than 3% change in power output.
Figure 3. Electroluminescence image of a 16 cell CuBert™ module
The team at Bert Thin Films has developed CuBert™ which is scalable, achieves high efficiencies and has proven durability. To learn more, contact info@BertThinFilms.com.
​Want more details?
